社会招聘

Sr. Analog Design Lead

招聘人数:1 人

2021.01.22

工作地点:

上海/合肥/United States

学历要求:

Bachelor Degree or above

职位要求:

  • Responsibilities:
    Perform analog circuit designs including architecture, top level design, block level design, circuit simulation, and layout supports
    Perform test, evaluation and debugging of prototype ICs
    Design for test, design for quality, design for manufacturing
    Top level AMS mixed-mode simulations
    Lead and mentor junior analog designers


Requirements:
A proven track record of leading analog designs and/or design teams and bringing development to production successfully
Strong/effective communication skills
Enthusiastic team-first mentality
Solid knowledge of industry-standard tools and best-in-class practices for analog/mixed-signal and power IC designs
Good knowledge in power converters (LDO, DC/DC converters & controllers, AC/DC converters & controllers, switching capacitor-based converters), and signal processing circuits (ADC, DAC, amplifiers, filters, etc.)
Solid knowledge in semiconductor devices (including LDMOS, DENMOS, DEPMOS, NPN & PNP bipolar transistors, NMOS, PMOS, etc.), basic analog blocks (e.g. bandgap references, charge pumps, oscillators), and BCD technologies
Analytical thinking and inventive spirit in combination with a solid understanding of risks and risk mitigation
Experience with Unix/Linux environments
Minimum 10 years of analog and mixed signal design experience
Experience with ESD protection design, wireless charging, wired fast charging (quick charge), power-over-ethernet (POE, PSE & PD), hot swap controllers, embedded MCU designs, etc. is a plus

IC Packaging Leader/Expert (Technologist)

招聘人数:1 人

2021.01.22

工作地点:

上海

学历要求:

MSEE or PhD in Mechanical, Materials Science, Chemical, or Electrical Engineering

职位要求:

Key Qualifications:


 ·        10+ relevant experience in IC/semiconductor packaging and/or system integration.

 ·        Good understanding of cross-functional packaging areas: system stack integration, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.

 ·        Expert in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.

 ·        Expertise in advanced power IC packaging technologies (like F/C QFN, WLCSP, Bumping, SIP, MCM, Copper Clip, Fan-out, etc.): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.

 ·        Strong background in Wafer Level Packaging, IC package assembly process, materials, equipment, reliability standards, FA techniques, etc.

 ·        Familiarity with packaging technologies, package substrate design rules and assembly rules.

 ·        Knowledge of the thermal and mechanical analysis of the IC package development is a plus.

 ·        Good communication skills that can enable the candidate to work well with internal cross functional teams and domestic/international suppliers. Understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out.

 ·        Ability to work independently and tackle projects with minimum supervision.

 ·        Drive methodology, innovations, and productivity improvements in package design together with vendors and developers on feature development and bug resolution

 ·        Good program/project management skill.

  



Sr. Digital Design Lead

招聘人数:1 人

2021.01.22

工作地点:

合肥

学历要求:

M.S. in Electrical Engineering

职位要求:

Responsibilities:

·        Work on the development of world advanced wireless charge or PMIC project

·        Perform digital circuit designs including architecture, RTL coding, simulation, verification, synthesis, and layout support

·        Perform test, evaluation and debugging of prototype ICs

·        Design for test, design for quality, design for mass production

·        Assist with top level mixed-mode simulations

 

Requirements:

·        M.S. in electrical engineering or a related field; at least three years of significant hands-on technical experience in Verilog

·        Strong experience in digital design implementation including architecture, logic and physical synthesis with constraints, timing analysis, gate level simulations

·        Experience with Industry standard design tools for RTL synthesis and timing analysis

·        Experience with embedded MCU, NVM, and RAM in advanced technologies

·        Strong interpersonal and communication skills

·        Experience with UVM is a plus

·        Experience with P&R is a plus

·        Experience in design prototyping, emulation and validation using FPGAs is a plus


优质团队

员工福利

你的收获

行——执行力强,鼓励把优质想法转换成产品,用结果证明 

知——知识储备雄厚,与时俱进开展行业发展、职位转化与职场技能培训 

优——优秀的团队,优厚的福利,优质的人生 

笑——丰富的团建活动,良好的办公氛围,开心高效的工作

薪酬待遇

职业发展

薪——高薪,只要你愿意、有勇气

满——金玉满堂,除了钱包,还有理想

益——收益,妥妥的财富、学识和技能

足——充足,能力越大,发展越远

公司福利

假期福利

我们关注员工身心健康。除法定假日外,我们还提供额外的福利年假及带薪病假

节日福利

我们感谢员工工作付出。适逢各类节日,我们会为员工准备丰富的节日福利

保险福利

我们保障员工身体健康。公司还为员工单独缴纳商业医疗保险及意外险

年度体检

我们在意员工健康,每年安排正规体检

团队建设

我们注重团队合作。为增强团队凝聚力,加深同志般的战斗友谊,每年组织2次以上团建活动

尊重知识 尊重人才

请将简历发送至邮箱:

hr@nuvoltatech.com

备注岗位+城市,对符合条件的候选人, HR会进行进一步沟通哦!